What is the difference between the film and the full film of the pcb circuit board?

    When the pcb circuit board is processed, there are two different choices: full film and film. In fact, this is selected according to the processing technology of the pcb circuit board factory.
    Whole piece: The processing technology is (two-sided circuit board) cutting - punching - CCP (one-time electroplating process is also called thickened copper) - route - two copper (pattern electroplating process) and then take the SES line (removal film - Etching process - tin stripping).
    Film: The processing technology is (double-sided circuit board) cutting - punching - CCP (one-time electroplating process is also called thickened copper) - route (without two copper pattern electroplating process) followed by DES line (etching process) -Remove film).
    The film of the pcb circuit board circuit board: it is usually the tentover processing technology that people talk about. The applied potion is the acid-alkaline etching process film because after the film photo is made, the required route or copper surface is completely transparent, not The possible part is gray-black. After being exposed through the route processing process, the fully transparent part is oxidized and hardened due to the sunlight exposure of the wet film resist. The wet film is washed away, so in the etching process, only a part of the copper pool (the gray and black part of the film photo) is washed away by the wet film, and the preservation of the wet film is not washed away and belongs to the route we want (the film photo is full). transparent part).
    The whole piece of pcb circuit board circuit board: it is usually called patTri processing technology, and the applied xian potion is a partial alkali etching process. If the whole piece is seen from the film photo, the required route or copper surface is gray-black, not black. Part of it can be fully transparent. After being exposed through the same route processing process, the fully transparent part is oxidized and hardened due to the sunlight exposure of the wet film resist, and the next developer processing process will not harden the bottom. The wet film is washed away, followed by the process of electroplating tin and lead. The tin and lead are plated on the copper surface washed away by the wet film of the previous process (developer), and then the film is removed (remove the hard bottom due to sunlight exposure). In the next etching process, the copper moor without tin and lead maintenance is cut off with alkaline water (a part of the film photo that is completely transparent), and the rest is the route we want (the film photo gray part of the black).